A test device of integrated circuit is prepared as setting conductive conversion unit connected with test circuit under probe positioning plate, electric-connecting tail of each probe to conductive conversion unit by passing said tail through integrated circuit space plate and probe positioning plate as both being set with through holes on them for passing through said tail, setting center distance between said through holes to be as the same with foot distance between centers of lead pins on integrated circuit to be tested and setting said foot distance to be 0.4mm-0.95mm. |