Original document(11 pages)  中文版
    To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.
Application Number
申请号		 200610126106 Application Date
申请日		 2006.08.21
Title 名称 Tin electroplating solution and tin electroplating method
Publication Number
公开号		 1928164 Publication Date
公开日		 2007.03.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C25D3/32
Applicant(s) Name
申请人		 Rohm And Haas Electronic Mater
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 weidong
More information 更  多  信  息


 Related patents information
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.