The related package for thermal-optical switch array/modulator comprises: configuring and fixing the target chip on a PCB by colloid; keeping a heat dissipation metal area on one side of PCB to cover whole board by routing gap; except former area, using other surface part of the PCB to form the control and drive circuit for the target chip; using through hole to complete the circuit connection between upper an lower layers; arranging contact electrodes near the metal area to pressure weld with the target chip. This invention has well heat dissipation effect with simple technique and well operation reliability. |