Original document(10 pages)  中文版
    The backboard manufacture process comprises: taking fusion to form a pixel reflection electrode on the substrate to electric connect with a switch control element in the substrate through an inner connection structure of substrate; on the reflection electrode, forming a plane protective layer, patterning the protective layer to expose the reflection electrode.
Application Number
申请号		 200510099161 Application Date
申请日		 2005.09.09
Title 名称 Backboard manufacturing process and pixel unit manufacturing method
Publication Number
公开号		 1928645 Publication Date
公开日		 2007.03.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 G02F1/1333
Applicant(s) Name
申请人		 UMC Corporation
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 taofeng bei houyu
More information 更  多  信  息


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