Disclosed is an organosilicon compound represented by the formula (I) below which can be used for suppressing coloring or thermal deterioration of an organic material during molding. (I) [In the formula, R1-R20 independently represent an alkyl, alkoxy, aryloxy, cycloalkyl, alkylcycloalkyl, aryl, dialkylamino group or the like, and the aryloxy and aryl groups among them may be substituted by a substituent selected from the group consisting of alkyl, alkoxy and alkoxyalkyl groups.] Also disclosed are an organic material composition containing such an organosilicon compound, and a method for producing such an organosilicon compound. |