| Original document(55 pages) 中文版 |
A liquid material is placed on a substrate as a droplet to form a film on the substrate. At least either one of a concentration of solids in the liquid material and a drying rate of the droplets is used as a parameter to control a form of a dried film of the droplets. Moreover, a first droplet is placed on a substrate, the first droplet is dried to form a dried film of a form in which a thickness of an edge is larger than that of a central part, and a second droplet is placed in a region surrounded by the edge section of a dried film of the first droplet to form a dried film of the second droplet. Furthermore, the liquid material is placed on the substrate as a droplet to form a film on the substrate, and a dried film of the droplet is formed by contracting the droplet. |
Application Number
申请号 |
200610132143 |
Application Date
申请日 |
2004.07.07 |
| Title 名称 |
Process for forming a film, process for manufacturing a device |
Publication Number
公开号 |
1933101 |
Publication Date
公开日 |
2007.03.21 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L21/00;H01L21/02;H01L21/208;H01L21/288;H01L21/3205;H01L21/768;H01L21/027;H01L51/00;G03F7/16;H05K3/10;B05D3/02 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
songge cheng |
| More information 更 多 信 息 |
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