Original document(8 pages)  中文版
    The invention is concerned with producing field of the high efficiency power semiconductor parts thyristor, especially the method that the III group element diffuses twice to improve high efficiency thyristor interdiction volt-ampere characteristic. The method includes the following steps: exceeds granule, cleans silicon chip, and cleans quartz closed-pipe source bottle, one time diffusion, and two time diffusion. It is: the normal temperature interdiction improves obviously, the leaking current minishs compare with the gallium extension obviously, and the high temperature leaking current minishs compare with the boron aluminum extension obviously. The invention is that not only improves the surface density of the CMOS chip, but also makes the P+ impurity thickness in the CMOS chip become stable.
Application Number
申请号
200610048001 Application Date
申请日
2006.10.13
Title 名称 Method for III family elements two-time spreading and raising large power transistor blocking current-voltage characteristics
Publication Number
公开号
1933110 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/332;H01L21/22
Applicant(s) Name
申请人
Huachen Electric Device Co., Ltd., Anshan City
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 zhangqun
More information 更  多  信  息


 Related patents information
Process for producing rectifier tube chip by one time coating source full spreading
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.