This is a method for wafer level vacuum encapsulation. Fix some tiny structure component on one base plate, and connect inner line of tiny structure component with bottom of base plate in type of inner line. Add one close cover on base plate and leave one space between close cover and each tiny structure component of base plate. Open at least one hole at each space position on the close cover for connecting the space and complete one encapsulation structure. Set it into one vacuum environment and achieve the vacuum state through all space and equably spread one layer of encapsulation stuff on close cover to fill each hole with encapsulation stuff and block out them, so the tiny structure components of each space all locate in vacuum state. The encapsulation stuff suffers over ripe and is incised into single encapsulation grain one by one. |