| Original document(27 pages) 中文版 |
To form a semiconductor package having a mirror surface for indicating 1 pin position on the surface thereof without exposing a bonding wire in the package by a mold having an ejector pin in a forming method of the semiconductor package. In the mold 20 having the ejector pin 21 used for resin sealing, the ejector pin is fixed to the mold by locating a tip end surface of the ejector pin having the molding mirror surface 23 between a crest and a root of a molding satin 22. Consequently, the satin and the mirror surface defined by the satin for indicating the 1 pin position are formed to be flush with each other, so that it is possible in a 1 pin position indication portion to greatly secure a gap between the bonding wire 13 and the package surface. |
Application Number
申请号 |
200610128853 |
Application Date
申请日 |
2006.08.31 |
| Title 名称 |
Method for forming semiconductor package, and metal mold for forming the same |
Publication Number
公开号 |
1933118 |
Publication Date
公开日 |
2007.03.21 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L21/56;B29C33/44 |
Applicant(s) Name
申请人 |
Oki Electric Ind Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
wangsi beng |
| More information 更 多 信 息 |
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