Original document(9 pages)  中文版
    The invention is concerned with the conducting layer manufacture method, it is: provides a base with a dielectric layer that is with a designing structure and emerges part of the conducting layer in the designing structure; processes the first cleaning step for the surface of the base; forms the covering layer on the emerged part of the conducting layer; processes the second cleaning step to remove the rudimental covering layer on surface of the dielectric layer; processes the drying cleaning dry step to the surface of the base in order to clean and dry the surface of the base.
Application Number
申请号
200510099540 Application Date
申请日
2005.09.13
Title 名称 Method for producing conducting layer
Publication Number
公开号
1933122 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/768;H01L21/28;H01L21/3213
Applicant(s) Name
申请人
Lianhua Electronic Co., Ltd.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 taofeng bei houyu
More information 更  多  信  息


 Related patents information
Cheminomechanical grinding method
Grinding pad recovery device structure and use
Method for making double inlaying latch by using metal hard shielding layer
Method for decreasing disc defect in chemicomechanical copper grinding
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
Embedded capacitor structure used for logic integrated cireuit
Method of producing intraconnecting copper wire in coverage layer
Chemical machinery grinding equipment
Method for producing high-density capacitors
Method for manufacturing sleeve
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.