This invention relates to an electronic component with a conduction connection structure, in which, multiple conduction media are set on the surface of a base plate and the surfaces of which are connected with multiple humps with conduction performance, which can be used for conducting to other electronic components directly or indirectly and a space and at least a hollow-out part conducting to the space, which deforms the pressed humps timely and provides space for injecting glue to intensify the felt result. |