| Original document(13 pages) 中文版 |
A semiconductor device including: a semiconductor chip in which an integrated circuit is formed; a plurality of electrodes formed on the semiconductor chip and arranged in a plurality of rows and a plurality of columns; a plurality of resin protrusions formed on a surface of the semiconductor chip on which the electrodes are formed; and a plurality of electrical connection sections formed on the resin protrusions.Thus, a semiconductor device capable of being downsized and having high reliability is provided. |
Application Number
申请号 |
200610129069 |
Application Date
申请日 |
2006.09.08 |
| Title 名称 |
Semiconductor device |
Publication Number
公开号 |
1933136 |
Publication Date
公开日 |
2007.03.21 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L23/482;H01L23/50 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
ligui liang |
| More information 更 多 信 息 |
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