| Original document(17 pages) 中文版 |
A wiring board is provided with an insulation base material 1, a plurality of conductor wirings 2a, 2b, and the projection electrodes 3 formed on each of the conductor wirings. The electrode pad of the semiconductor element can be connected to the conductor wiring via the projection electrodes. The conductor wiring can be connected to an external component in a connection terminal 11 of an end opposite to the projection electrode side, and includes the first conductor wiring 2a and the second conductor wiring 2b each having the projection electrode formed on the semiconductor mounting region 12. The first wiring extends from the projection electrodes to the connection terminal. The second wiring extends from the projection electrodes to a region which is out of the semiconductor mounting region and does not reach the connection terminal, and the end extending to the region out of the semiconductor mounting region is electrically separated from the first conductor wiring by a disconnection 13 formed on a boundary region between itself and the first conductor wiring. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals. |
Application Number
申请号 |
200610151579 |
Application Date
申请日 |
2006.09.13 |
| Title 名称 |
Wiring board and method for manufacturing the same, and semiconductor device |
Publication Number
公开号 |
1933139 |
Publication Date
公开日 |
2007.03.21 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L23/498;H01L23/12;H01L21/48;H05K1/02;H05K3/02 |
Applicant(s) Name
申请人 |
Matsushita Electric Ind Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
chenyang dun |
| More information 更 多 信 息 |
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