Original document(30 pages)  中文版
    The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.
Application Number
申请号		 200610132035 Application Date
申请日		 2002.05.30
Title 名称 Electroless plating liquid and semiconductor device
Publication Number
公开号		 1933143 Publication Date
公开日		 2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/522;H01L21/768;C23C18/34
Applicant(s) Name
申请人		 Ebara Corp.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 wangyong gang
More information 更  多  信  息


 Related patents information
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.