This invention relates to a chip package body and a package structure of stacked chips, in which, the package body includes a first circuit base plate, a first chip, a second circuit base plate, a second chip and a conducting post, in which the first circuit has a first conducting through hole and the first chip is matched on the first circuit base plate and connected with it electrically, the second circuit base plate has a second conducting through hole, the second chip is matches on it and connected with it electrically, the second circuit base plate is above the first, the two chips are set between the two base plates and the first hole is corresponding to the second hole, the conducting post is set in the two holes and the first one is connected to the second one by the post. |