The invention provides an electron package structure with a System In Package arrangement, the structure comprises at least a conductor joint chip and at least a flip-chip package chip. The at least a conductor joint chip is positioned on one layer of a first layer and a second layer, the at least a flip-chip package chip is positioned on the other layer of the first layer and the second layer. The invention joints a lot of ICs in the SIP sturcture by z joints of routing machine, reduces the complexity of connecting a two-stacks conductor joint chip to a supporting substrate or a connecting surface, and increases a design elasticity. |