Original document(37 pages)  中文版
    A memory cell array includes a plurality of active areas in which a plurality of memory cells are formed. A memory cell includes a storage capacitor, a transistor at least partially formed in a semiconductor substrate with a substrate surface, the transistor including a first source/drain region. A second source/drain region being formed adjacent to the substrate surface, a channel region connecting the first and second source/drain regions. The first source/drain region is formed adjacent to the substrate surface. The channel region is disposed in the semiconductor substrate, and a gate electrode. Rows of the active areas are separated from each other by isolation grooves that extend along a first direction. A first and a second word lines are disposed on either lateral sides of each of the rows of active areas. The first and the second word lines are connected with each other via the gate electrodes of the transistors of the corresponding row of active areas.
Application Number
申请号
200610077846 Application Date
申请日
2006.05.08
Title 名称 Trench transistor dram cell array and method of making the same
Publication Number
公开号
1933160 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L27/108;H01L21/8242
Applicant(s) Name
申请人
Infineon Technologies AG
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 zhangxue mei zhangzhi cheng
More information 更  多  信  息


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