Original document(22 pages)  中文版
    To provide a semiconductor device and its manufacturing method that can suppress both leakage currents resulting from thermal emission of electrons from an electrode and from the tunneling effect, which has an MIM capacitor capable to maintain a high specific inductive capacity. The semiconductor device is equipped with a capacitor that is formed by laminating a lower electrode 16, a capacitance insulating film 18, and an upper electrode 20 one after another, wherein the capacitance insulating film 18 is composed of Hf oxide or Zr oxide, and a barrier film 17 is formed between the lower electrode 16 and the capacitance insulating film 18 that is composed of Hf oxide or Zr oxide containing at least either one of Al and Si.
Application Number
申请号
200610091228 Application Date
申请日
2006.06.07
Title 名称 Semiconductor device and method for fabricating the same
Publication Number
公开号
1933161 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L27/108;H01L27/102;H01L27/10;H01L27/02;H01L27/00;H01L21/8242;H01L21/8222;H01L21/82;H01L21/316;H01L21/02;H01L21/00
Applicant(s) Name
申请人
Matsushita Electric Ind Co., Ltd.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 wanghui min
More information 更  多  信  息


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