Original document(20 pages)  中文版
    The present invention is directed to a thick film conductor composition comprised of (a) aluminum-containing powder; (b) one or more glass frit compositions; dispersed in (c) organic medium wherein at least one of said glass frit compositions has a softening point of less than 400 DEG C.
Application Number
申请号
200610091548 Application Date
申请日
2006.06.07
Title 名称 Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
Publication Number
公开号
1933183 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L31/0224;H01L31/18;H01B3/00
Applicant(s) Name
申请人
Du Pont
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 zhuli meng
More information 更  多  信  息


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