Original document(11 pages)  中文版
    A method for preparing vibration diaphragm chip of silicon microphone includes defining disengagement layer being able to be dissolved in preset etching solution on base plate and defining isolation block layer and vibration diaphragm layer upwards in sequence then evaporating out seed crystal film as seed by utilizing conductor material on vibration diaphragm layer, using polymer to define out sacrifice layer covering relevant region on vibration layer and exposing partial seed crystal film, forming ring wall and etching off sacrifice layer to form vibration diaphragm chip then corroding off disengagement layer.
Application Number
申请号
200510099338 Application Date
申请日
2005.09.14
Title 名称 Vibrating diaphragm chip of silicon microphone and producing method thereof
Publication Number
公开号
1933682 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H04R31/00;H04R19/01
Applicant(s) Name
申请人
Jiale Electronic Co., Ltd.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 dinghui min
More information 更  多  信  息


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