Original document(18 pages)  中文版
    Disclosed is an epoxy resin composition for semiconductor encapsulation which has good soldering heat resistance and excellent productivity. Also disclosed is a semiconductor device. Specifically disclosed is an epoxy resin composition for semiconductor encapsulation which contains (A) an epoxy resin, (B) a phenol resin, (C) an organopolysiloxane (C-1) having a carboxyl group and/or a reaction product (C-2) of an organopolysiloxane having a carboxyl group and an epoxy resin, and (D) a fatty acid triglyceride.
Application Number
申请号		 200580008459 Application Date
申请日		 2005.03.15
Title 名称 Epoxy resin composition and semiconductor device
Publication Number
公开号		 1934156 Publication Date
公开日		 2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C08G59/62;C08K5/103;C08L63/00;H01L23/29;H01L23/31
Applicant(s) Name
申请人		 Sumitomo Bakelite Co.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 gaolong xin
More information 更  多  信  息


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