Original document(17 pages)  中文版
    An epoxy resin composition for semiconductor sealing that contains no hazardous substances out of regard for environment and excels in soldering heat resistance at the time of mounting and further in productivity; and a semiconductor device including sealing thereby. There is provided an epoxy resin composition for semiconductor sealing, characterized in that not only are an epoxy resin of given structure (A) and a phenolic resin of given structure (B) contained as main components but also a phenolic resin wherein the area ratio of a component having three or less aromatic rings per molecule in GPC analysis is 0.8% or less is contained as an essential component. Further, there is provided a semiconductor device characterized in that it comprises a semiconductor element sealed with the epoxy resin composition.
Application Number
申请号		 200580008460 Application Date
申请日		 2005.02.10
Title 名称 Epoxy resin composition and semiconductor device
Publication Number
公开号		 1934157 Publication Date
公开日		 2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C08G59/62;C08G59/20;H01L23/29;H01L23/31
Applicant(s) Name
申请人		 Sumitomo Bakelite Co.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 wuxiao ying
More information 更  多  信  息


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