Original document(35 pages)  中文版
    An epitaxial silicon carbide layer is fabricated by forming first features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The first features include at least one sidewall that is orientated nonparallel (i.e., oblique or perpendicular) to the crystallographic direction. A first epitaxial silicon carbide layer is then grown on the surface of the silicon carbide substrate that includes first features therein. Second features are then formed in the first epitaxial layer. The second features include at least one sidewall that is oriented nonparallel to the crystallographic direction. A second epitaxial silicon carbide layer is then grown on the surface of the first epitaxial silicon carbide layer that includes the second features therein.
Application Number
申请号
200580008606 Application Date
申请日
2005.02.14
Title 名称 Sequential lithographic methods to reduce stacking fault nucleation sites and structures having reduced stacking fault nucleation sites
Publication Number
公开号
1934676 Publication Date
公开日
2007.03.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/04;H01L21/20;H01L21/205
Applicant(s) Name
申请人
Cree Inc.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 yangkai liangyong
More information 更  多  信  息


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