This invention relates to a simple beam MEMS explore cards preparation methods, using UV-LIGA many lithography, preparation of flexible probe in the metal films with electroplating process, using the simple structure probe instead of the cantilever beam to bear the stress and greater oxide film holes, and regulate the probe displacement through the design of thickness of simple beams. Chip cards in accordance with the present invention, are obtained by the joint distribution and arrangement of the functions of the simple beam array, simply supported beam probe in the middle, and ensure the location of the needle position consistent with the corresponding pin chip. The bottom end of SR beam is the plating metal wire, which external from the bottom end around to the probe extension spot welding to connect to the corresponding printed circuit board, thus testing machine connected to the signal from the probe circuit. The invention process is simple, high productivity, control probe shape and size very well, high accuracy, suitable for mass production. |