A contact assembly and an LSI chip inspecting device using the same are disclosed. The contact assembly is mounted between an electronic device to be tested and a circuit inspecting device to electrically connect them. The contact assembly includes vertical type probes having elastic deforming parts on a first terminal, a second terminal, and therebetween; and contacts, each of which includes vertical type probes and a ribbon-shaped resin film to which the vertical type probes are mounted apart from each other in a longitudinal direction, a position determining member for overlapping the contacts in a surface direction of the ribbon-shaped resin film such that the contacts are separated from each other, and fixing the contacts adjactly to plaurity of the said contacts, and moving the vertical type probes in the length direction in spectificated space. The guide block is formed with a recess in which the position determining member is seated, so that front terminal of the vertical type probes protrude above and below surface planes of the guide block, perpendicularly thereto to position and support the contacts. |