Original document(27 pages)  中文版
    The described embodiments relate to features (905) in substrates (300) and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate (300) extending between a first substrate surface (302) and a generally opposing second substrate surface (303), and at least one feature (905) formed into the first surface (302) along a bore axis that is not transverse to the first surface (302).
Application Number
申请号		 200580010115 Application Date
申请日		 2005.03.29
Title 名称 Features in substrates and methods of forming
Publication Number
公开号		 1938158 Publication Date
公开日		 2007.03.28
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B41J2/14;B41J2/16
Applicant(s) Name
申请人		 Hewlett Packard Development Co.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 yangsong ling
More information 更  多  信  息


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