Original document(27 pages)  中文版
    According to one embodiment, a plate material cutting method prepares a plate material including a joining member that joins a main body portion to a throw-out portion, sets the plate material on a die including an opening section, and pushes a punch against the joining member. The punch includes a first end portion corresponding to a first end of the joining member which is connected to the main body portion. The punch also includes a second end portion corresponding to a second end of the joining member which is connected to the throw-out portion. A gap smaller than thickness of the plate material is defined between the first end portion of the punch and an inner surface of the opening section. A gap larger than the thickness of the plate material is defined between the second end portion of the punch and the inner surface of the opening section.
Application Number
申请号
200610105746 Application Date
申请日
2006.07.21
Title 名称 Plate material cutting method, printed circuit board, and electronic device
Publication Number
公开号
1939612 Publication Date
公开日
2007.04.04
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B21D28/02;B21D28/14;B21D37/00;B26F1/38;B26F1/44;H05K1/00
Applicant(s) Name
申请人
Toshiba KK
Address 地址
Inventor(s) Name 发明人 Aoki Makoto
Attorney & Agent 代理人 shiyan ming
More information 更  多  信  息


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