| Original document(15 pages) 中文版 |
Disclosed is a surface acoustic wave device wherein an encapsulation resin for sealing a mounting board and a surface acoustic wave element has a three-layer structure. The resin forming the intermediate layer has a higher elastic modulus than the resin forming the outermost layer, and the resin forming the innermost layer has a lower elastic modulus than the resin forming the outermost layer. By having such an encapsulation resin of three-layer structure, deformation of a bump when an external force is applied to the surface acoustic wave device is reduced, and stress applied to a bump due to temperature change is also reduced. |
Application Number
申请号 |
200680000180 |
Application Date
申请日 |
2006.02.27 |
| Title 名称 |
Surface acoustic wave device |
Publication Number
公开号 |
1943111 |
Publication Date
公开日 |
2007.04.04 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H03H9/25;H01L21/60;H01L23/29;H01L23/31 |
Applicant(s) Name
申请人 |
Matsushita Electric Ind Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
ligui liang |
| More information 更 多 信 息 |
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